Abstract
As artificial intelligence models scale beyond trillions of parameters, traditional electrical interconnects face insurmountable bandwidth, power, and latency constraints. CP Megalink (Co-Packaged Megalink) is an optical interconnect architecture that integrates dense wavelength-division multiplexing (DWDM) photonic engines directly inside the switch package. This paper details the physical layer design, power efficiency (≤5 pJ/bit), aggregate bandwidth (51.2 Tb/s per switch), and fabric latency (sub-100 ns per hop). Comparative analysis against PCIe Gen6 and InfiniBand NDR shows a 3.2× improvement in effective bandwidth density. We further evaluate reliability under thermal stress and present a scaling roadmap toward 400 Tb/s by 2028.
Key Features of Megalink:
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CP Megalink is a cutting-edge connectivity platform designed to provide high-speed, low-latency, and highly reliable connections for a wide range of applications. Developed by leading technology experts, CP Megalink leverages advanced technologies such as software-defined networking (SDN), network functions virtualization (NFV), and artificial intelligence (AI) to deliver unparalleled connectivity performance. cp megalink
Energy savings: At 51.2 Tb/s aggregate, CP Megalink consumes ~256 W for optics, versus ~921 W for equivalent electrical SerDes (36 pJ/bit typical). Prison: Lengthy, mandatory minimum sentences without parole
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