Wcd9341 Datasheet

The WCD9341 is a high-tier discrete audio codec from the Qualcomm Aqstic family, specifically engineered to deliver high-fidelity (Hi-Fi) audio for flagship mobile devices. Originally paired with the Snapdragon 835 mobile platform, it serves as a critical component in smartphones like the Samsung Galaxy S8 and Note 8 to provide studio-quality sound reproduction. WCD9341 Technical Specifications

Integrated Tech: Includes a dedicated hardware block for Active Noise Cancellation (ANC) and supports "always-listening" voice UI wake-up words at low power. Application Guide SM-G960U/W/U1 Common - iFixit wcd9341 datasheet

: Supports "Always-on" voice UI, including voice activation and low-power keyword detection. Connectivity : Integrated support for the interface for digital audio channel access. : Features a configuration commonly found in mobile device repair parts. Typical Applications Flagship Smartphones : Found in the Samsung Galaxy series The WCD9341 is a high-tier discrete audio codec

: Galaxy S8 / S8 Plus, S10 series, Note 8, Note 9, and Note 10 series. Other Devices : Integrated into devices like the Xiaomi Mi Note 2 to achieve their highly-rated audio quality. Repair and Replacement Parts High-Resolution Audio Support : Up to 32-bit/384 kHz

The Qualcomm WCD9341 is a high-fidelity Aqstic audio codec supporting up to 384-kHz/32-bit PCM and native DSD playback, designed for flagship mobile devices. It delivers a 130-dB dynamic range and -105-dB THD+N, often paired with the Snapdragon 835 to enable premium, low-distortion audio. For technical specifications and data sheet information, visit Qualcomm Technical Documentation

2. Key Features

• High-Resolution Audio Support: Up to 32-bit/384 kHz PCM playback and native DSD (Direct Stream Digital) support (DSD64, DSD128).
• Multi-Channel Audio: 2-channel stereo DAC with differential outputs, plus multiple ADC inputs for active noise cancellation and beamforming microphones.
• Low Power Consumption: Optimized for portable devices; includes multiple power domains and flexible clocking.
• Integrated DSP: Qualcomm® Hexagon™ DSP for audio effects (EQ, dynamic range compression, surround virtualization).
• Smart Amplifier Support: Direct interface for Class-D smart power amplifiers (e.g., WSA8815) with real-time speaker protection algorithms.
• Audio Inputs: Up to 4 analog microphones or 8 digital microphones (PDM interface).
• Audio Outputs: Stereo line-out, high-impedance headphone driver (up to 2Vrms), earpiece, and loudspeaker driver.

1.1 Core Architecture

• Type: High-performance audio codec with integrated digital signal processor (DSP).
• Package: 6.11 mm × 5.05 mm, 135-ball WLCSP (Wafer-Level Chip Scale Package).
• Ball Pitch: 0.4 mm.
• Analog Supply Voltage (VA): 1.8 V – 2.0 V.
• Digital Supply Voltage (VDD): 1.14 V – 1.26 V.
• Headphone Supply (VDD_HPH): Up to 4.0 V (for Class H amplifier).

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THD+N Performance: Engineered for extremely low Total Harmonic Distortion plus Noise to provide "pure, premium sound".